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Data Sheet May 16, 2008
HC006/010 Series DC-DC Converter Power Modules: 18-36Vdc Input; 3.3V-5Vdc Output; 6.6A-10A Output Current
Features
RoHS Compliant
Compliant to RoHS EU Directive 2002/95/EC (-Z versions) Compliant to ROHS EU Directive 2002/95/EC with lead solder exemption (non-Z versions) Delivers up to 10A Output current 5V (6.6A), 3.3V (10A) High efficiency - 90% at 3.3V full load Low Output voltage- supports migration to future IC supply voltages down to 1.0V Low output ripple and noise Small Size and low profile
Applications
Wireless Networks Distributed power architectures Optical and Access Network Equipment Enterprise Networks Latest generation IC's (DSP, FPGA, ASIC) and Microprocessor powered applications
47.2mm x 29.5mm x 8.5mm (1.86 x 1.16 x 0.335 in) Surface mount or Through hole (TH) Remote On/Off Output overcurrent/Over voltage protection Over temperature protection Single Tightly regulated output Output voltage adjustment trim 10% Wide operating temperature range (-40C to 85C) Meets the voltage insulation requirements for ETSI 300-132-2 and complies with and is Licensed for Basic Insulation rating per EN 60950 CE mark meets 73/23/EEC and 93/68/EEC directives UL* 60950-1Recognized, CSA C22.2 No. 60950-1 03 Certified, and VDE 0805:2001-12 (EN60950-1) Licensed ISO** 9001 and ISO 14001 certified manufacturing facilities
Options
Remote On/Off logic (positive or negative) Surface Mount (-S Suffix) Trimmed leads
Description
The HC series power modules are isolated dc-dc converters that operate over a wide input voltage range of 18 to 36 Vdc and provide one precisely regulated output. The output is fully isolated from the input, allowing versatile polarity configurations and grounding connections. The modules exhibit high efficiency, e.g. typical efficiency of 90% 3.3/10A, 91% at 5V/6A. Built-in filtering for both input and output minimizes the need for external filtering. These open frame modules are available either in surface-mount (-S) or in through-hole form.
* UL is a registered trademark of Underwriters Laboratories, Inc.

CSA is a registered trademark of Canadian Standards Association. VDE is a trademark of Verband Deutscher Elektrotechniker e.V. ** ISO is a registered trademark of the International Organization of Standards
Document No: DS03-122 ver. 1.44 PDF name: hc006-010_series_ds.pdf
Data Sheet May 16, 2008
HC006/010 Series DC-DC Power Module: 18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability.
Parameter Input Voltage Operating Ambient Temperature (see Thermal Considerations section) Storage Temperature I/O Isolation Voltage (100% factory tested) All All Tstg -55 125 1500 C Vdc Device All All Symbol VIN TA Min -0.3 -40 Max 50 85 Unit Vdc C
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.
Parameter Operating Input Voltage Maximum Input Current (VIN=0V to 75V, IO=IO, max) Inrush Transient Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 12H source impedance; VIN=0V to 75V, IO= IOmax ; see Figure 9) Input Ripple Rejection (120Hz) EMC, EN55022 All All All It 3 50 See EMC Considerations section
2
Device HC HC
Symbol VIN IIN,max
Min 18
Typ 24
Max 36 3.2
Unit Vdc Adc
1
As mAp-p dB
2
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to an integrated part of a sophisticated power architecture. To preserve maximum flexibility, internal fusing is not included, however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 5A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer's data sheet for further information.
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Data Sheet May 16, 2008
HC006/010 Series DC-DC Power Module: 18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
Electrical Specifications (continued)
Parameter Output Voltage Set-point (VIN=VIN,nom, IO=IO, max, Tref=25C) Output Voltage (Over all operating input voltage, resistive load, and temperature conditions until end of life) Adjustment Range Selected by external resistor Output Regulation Line (VIN=VIN, min to VIN, max) Load (IO=IO, min to IO, max) Temperature (Tref=TA, min to TA, max) Output Ripple and Noise on nominal output (VIN=VIN, nom and IO=IO, min to IO, max) Measured across 10F tantalum//1F ceramic RMS (5Hz to 20MHz bandwidth) Peak-to-Peak (5Hz to 20MHz bandwidth) External Load Capacitance All All 3.3V 5.0V Output Current (At Io < Io,min the output ripple may exceed the The max specifications. All modules shall Operate at no load without damage and without exceeding 100% of VO, set ) Output Current Limit Inception (Vo = 90% of VO, set) Output Short-Circuit Current (VO250mV) Efficiency VIN=VIN, nom, TA=25C IO=IO, max , VO= VO,set 3.3V 5.0V CO, max CO, max Io Io 0 0 0.05 0.05 8 40 20 75 1000 470 10 6.6 mVrms mVpk-pk F F Adc Adc All All All 0.2 0.1 10 % VO, set mV % VO, set All VO -10.0 +10.0 % VO, set Device 3.3V 5.0V All Symbol VO, set VO, set VO Min 3.25 4.92 -3.0 Typ 3.3 5.0 Max 3.35 5.08 +3.0 Unit Vdc Vdc % VO, set
3.3V 5.0V 3.3V 5.0V 3.3V 5.0V
IO, lim IO, lim IO, s/c IO, s/c

12 8 17 13 90.0 91.0

Adc Adc Adc Adc % %
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Data Sheet May 16, 2008
HC006/010 Series DC-DC Power Module: 18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
Electrical Specifications (continued)
Parameter Switching Frequency Dynamic Load Response (Io/t=0.1A/s; Vin=Vin,nom; TA=25C) Load Change from Io= 50% to 75% of Io,max Peak Deviation Settling Time (Vo<10% peak deviation) (Io/t=0.1A/s; Vin=Vin,nom; TA=25C) Load Change from Io= 75% to 50% of Io,max Peak Deviation Settling Time (Vo<10% peak deviation) All All Vpk ts 200 200 mV s All Vpk ts 200 200 mV s Device All Symbol fsw Min Typ 285 Max Unit kHz
Isolation Specifications
Parameter Isolation Capacitance Isolation Resistance Symbol Ciso Riso Min 10 Typ 1000 Max Unit pF M
General Specifications
Parameter Calculated MTBF (for HC010A0F1 in accordance with Lucent RIN: IO=80% of IO, max, TA=25C, airflow=1m/s) Weight Min Typ > TBD 13 (0.46) Weight Max Unit Hours
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Data Sheet May 16, 2008
HC006/010 Series DC-DC Power Module: 18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information.
Parameter Remote On/Off Signal Interface (VIN=VIN, min to VIN, max ; open collector or equivalent, Signal referenced to VIN- terminal) Negative Logic: device code suffix "1" Logic Low = module On, Logic High = module Off Positive Logic: No device code suffix required Logic Low = module Off, Logic High = module On Logic Low Specification Remote On/Off Current - Logic Low On/Off Voltage: Logic Low Logic High - (Typ = Open Collector) Logic High maximum allowable leakage current Turn-On Delay and Rise Times (VIN=VIN, nom, IO=IO, max , VO to within 1% of steady state) Case 1: On/Off input is set to Logic high and then input power is applied (delay from instant at which VI = VI,min until Vo = 10% of Vo, set) Case 2: Input power is applied for at least one second and then the On/Off input is set to logic high (delay from instant at which Von/Off = 0.9V until Vo = 10% of Vo, set) Output voltage Rise time (time for Vo to rise from 10% of Vo, set to 90% of Vo, set) Output voltage overshoot (VIN=VIN, nom, Io = 80% of Io,max, TA=25C) Output Overvoltage Protection Overtemperature Protection (See Feature Descriptions) Input Undervoltage Lockout Turn-on Threshold Turn-off Threshold
Device
Symbol
Min
Typ
Max
Unit
All All All All
Ion/off Von/off Von/off Ion/off
-0.7
0.15
1.0 1.2 15 50
mA V V A
All
Tdelay
20
msec
All
Tdelay
12
msec
All All 3.3V 5.0V All
Trise
5
msec
VO, limit VO, limit Tref
4.0 6.1 125
5 4.6 7.0
%VO,
set
V V C
HC HC
13
16 14
18
V V
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Data Sheet May 16, 2008
HC006/010 Series DC-DC Power Module: 18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
Characteristic Curves
The following figures provide typical characteristics for the HC010A0F (3.3V, 10A) at 25C. The figures are identical for either positive or negative Remote On/Off logic.
94
12
OUTPUT CURRENT, Io (A)
90
10 8 6 NC 4 0.5m/s (100 LFM ) 2 1.0m/s (200 LFM ) 0 20 30 40 50 60 70 80
O
EFFICIENCY, (%)
86 82
VIN = 1 8V
78
VIN = 24V
74
VIN = 36V
70 0 2 4 6 8 10
90
OUTPUT CURRENT, IO (A)
AMBIENT TEMPERATURE, TA C
Figure 1. Converter Efficiency versus Output Current
Figure 4. Derating Output Current versus Local Ambient Temperature and Airflow
OUTPUT VOLTAGE INPUT VOLTAGE
OUTPUT VOLTAGE,
VO (V) (20mV/div)
VIN (V) (20V/div)
VO (V) (1V/div)
TIME, t (1s/div)
TIME, t (20ms/div)
Figure 2. Typical Output Ripple and Noise.
Figure 5. Typical Start-Up with application of Vin (VIN =24Vdc, Io = 10A).
On/Off VOLTAGE OUTPUT VOLTAGE
OUTPUT CURRENT, OUTPUT VOLTAGE
VO (V) (200mV/div)
IO (A) (2A/div)
VON/OFF(V) (10V/div)
VO (V) (1V/div)
TIME, t (100s/div)
TIME, t (20ms/div)
Figure 3. Transient Response to Dynamic Load Change from 50% to 75% to 50% of full load.
Figure 6. Typical Start-Up Using Remote On/Off, negative logic version shown.
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Data Sheet May 16, 2008
HC006/010 Series DC-DC Power Module: 18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
Characteristic Curves (continued)
The following figures provide typical characteristics for the HC006A6A (5.0V,6.6A) at 25C. The figures are identical for either positive or negative Remote On/Off logic.
94%
8
OUTPUT CURRENT, Io (A)
90%
6
EFFICIENCY, (%)
86% 82% Vin=18V 78% Vin=24V 74% Vin=36V 70% 0 1 2 3 4 5 6
5 NC 3 0.5m/s (100 LFM ) 2 1.0m/s (200 LFM ) 0 20 30 40 50 60 70 80
O
90
OUTPUT CURRENT, IO (A)
AMBIENT TEMPERATURE, TA C
Figure 7. Converter Efficiency versus Output Current
Figure 10. Derating Output Current versus Local Ambient Temperature and Airflow
INPUT VOLTAGE, OUTPUT VOLTAGE
OUTPUT VOLTAGE,
VO (V) (20mV/div)
VIN (V) (20V/div)
VO (V) (1V/div)
TIME, t (1s/div)
TIME, t (20ms/div)
Figure 8. Typical Output Ripple and Noise (VIN =24Vdc, Io = 6.6A).
OUTPUT CURRENT, OUTPUT VOLTAGE VO (V) (200mV/div)
Figure 11. Typical Start-Up with application of Vin (VIN =48Vdc, Io = 6.6A).
OUTPUT VOLTAGE On/Off VOLTAGE
VON/OFF(V) (10V/div)
IO (A) (2A/div)
VO (V) (1V/div)
TIME, t (100s/div)
TIME, t (20ms/div)
Figure 9. Transient Response to Dynamic Load Change from 50% to 75% to 50% of full load.
Figure 12. Typical Start-Up Using Remote On/Off, negative logic version shown (VIN =24Vdc, Io = 6.6A).
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Data Sheet May 16, 2008
HC006/010 Series DC-DC Power Module: 18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
Test Configurations
TO OSCILLOSCOPE LTEST Vin+ 12H CURRENT PROBE
Design Considerations
Input Source Impedance
The power module should be connected to a low ac-impedance source. A highly inductive source impedance can affect the stability of the power module. For the test configuration in Figure 13, a 33F electrolytic capacitor (ESR<0.7 at 100kHz), mounted close to the power module helps ensure the stability of the unit. Consult the factory for further application guidelines.
BATTERY
CS
220F
33F
E.S.R.<0.1 @ 20C 100kHz Vin-
NOTE: Measure input reflected ripple current with a simulated source inductance (LTEST) of 12H. Capacitor CS offsets possible battery impedance. Measure current as shown above.
Safety Considerations
For safety-agency approval of the system in which the power module is used, the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standard, i.e., UL 60950-1-3, CSA C22.2 No. 60950-00, and VDE 0805:2001-12 (IEC60950-1). If the input source is non-SELV (ELV or a hazardous voltage greater than 60 Vdc and less than or equal to 75Vdc), for the module's output to be considered as meeting the requirements for safety extra-low voltage (SELV), all of the following must be true:
The input source is to be provided with reinforced insulation from any other hazardous voltages, including the ac mains. One VIN pin and one VOUT pin are to be grounded, or both the input and output pins are to be kept floating. The input pins of the module are not operator accessible.
Figure 13. Input Reflected Ripple Current Test Setup.
COPPER STRIP VO (+) 1uF . V O (-) 10uF SCOPE RESISTIVE LOAD
GROUND PLANE NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance.
Figure 14. Output Ripple and Noise Test Setup.
Rdistribution
Rcontact Vin+ Vout+
Rcontact
Rdistribution
VIN
VO
RLOAD
Another SELV reliability test is conducted on the whole system (combination of supply source and subject module), as required by the safety agencies, to verify that under a single fault, hazardous voltages do not appear at the module's output.
Rdistribution
Rcontact VinVout-
Rcontact
Rdistribution
NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance.
Figure 15. Output Voltage and Efficiency Test Setup.
VO. IO Efficiency = VIN. IIN x 100 %
Note: Do not ground either of the input pins of the module without grounding one of the output pins. This may allow a non-SELV voltage to appear between the output pins and ground. The power module has extra-low voltage (ELV) outputs when all inputs are ELV. For input voltages exceeding -60 Vdc but less than or equal to -75 Vdc, these converters have been evaluated to the applicable requirements of BASIC INSULATION between secondary DC MAINS DISTRIBUTION input (classified as TNV-2 in Europe) and unearthed SELV outputs."All flammable materials used in the manufacturing of these modules are rated 94V-0 and UL60950 A.2 for reduced thicknesses. The input to these units is to be provided with a maximum 3A fastacting fuse in the unearthed lead."
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Data Sheet May 16, 2008
HC006/010 Series DC-DC Power Module: 18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
Feature Description
Remote On/Off
Two remote on/off options are available. Positive logic turns the module on during a logic high voltage on the ON/OFF pin, and off during a logic low. Negative logic remote On/Off, device code suffix "1", turns the module off during a logic high and on during a logic low.
begin to operate at an input voltage above the undervoltage lockout turn-on threshold.
Over Voltage Protection
The output overvoltage protection clamp consists of control circuitry, independent of the primary regulation loop, that monitors the voltage on the output terminals. This control loop has a higher voltage set point than the primary loop (See the overvoltage clamp values in the Feature Specifications Table). In a fault condition, the overvoltage clamp ensures that the output voltage does not exceed Vo,ovsd, max. This provides a redundant voltage-control that reduces the risk of output overvoltage.
VIN(+)
Ion/off ON/OFF
VO
Over Temperature Protection
COM
Von/off
VIN(-)
To provide protection in a fault condition, the unit is equipped with a thermal shutdown circuit. The unit will o shutdown if the overtemperature threshold of 125 C is exceeded at the thermal reference point Tref . Once the unit goes into thermal shutdown it will then wait to cool before attempting to restart.
Output Voltage Programming
Figure 16. Remote On/Off Implementation. To turn the power module on and off, the user must supply a switch (open collector or equivalent) to control the voltage (Von/off) between the ON/OFF terminal and the VIN(-) terminal. Logic low is -0.7V Von/off 1.2V. The maximum Ion/off during a logic low is 1mA, the switch should be maintain a logic low level whilst sinking this current. During a logic high, the maximum Von/off generated by the module is 15V, and the maximum allowable leakage current at Von/off = 15V is 50A. If not using the remote on/off feature: For positive logic, leave the ON/OFF pin open. For negative logic, short the ON/OFF pin to VIN(-). Trimming allows the output voltage set point to be increased or decreased, this is accomplished by connecting an external resistor between the TRIM pin and either the VO(+) pin or the VO(-) pin (COM pin) .
VIN(+) VO(+) Rtrim-up ON/OFF VOTRIM Rtrim-down VIN(-) COM LOAD
Overcurrent Protection
To provide protection in a fault (output overload) condition, the module is equipped with internal current-limiting circuitry, and can endure current limiting continuously. At the instance of current-limit inception, the output current begins to tail-out. When an overcurrent condition exists beyond a few seconds, the module enters a "hiccup" mode of operation, whereby it shuts down and automatically attempts to restart upon cooling. While the fault condition exists, the module will remain in this hiccup mode, and can remain in this mode until the fault is cleared. The unit operates normally once the output current is reduced back into its specified range. Figure 17. Circuit Configuration to Trim Output Voltage. Connecting an external resistor (Rtrim-down) between the TRIM pin and the COM pin decreases the output voltage set point. The following equation determines the value of trim-down resistor needed to decrease the output voltage from Vo,set to Vo:
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout limit, the module operation is disabled. The module will
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Data Sheet May 16, 2008
HC006/010 Series DC-DC Power Module: 18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
45.5(100 + 10) - 1690 Rtrim - up = - 73.1k 10 Rtrim - up = 258.4k
Feature Descriptions (continued)
Output Voltage Programming (continued)
A Rtrim - down = - B k %
Rtrim-down is the external resistor in k % is the % change in output voltage Values of A & B are provided in Table 1 Table 1 Output Voltage (V) 3.3V 5.0V 1690 1690 73.1 73.1 A B
Connecting an external resistor (Rtrim-up) between the TRIM pin and the VO(+) pin increases the output voltage set point. The relationship between the output voltage and the trim resistor value for a % increase in output voltage is:
A(100 + % - B Rtrim - up = - C k %
Rtrim-up is the external resistor in k % is the % change in output voltage Values of A , B and C are provided in Table 2 Table 2 Output Voltage (V) 3.3 5.0 A 45.5 69.0 B 1690 1690 V 73.1 73.1
Examples: To trim down the output of a nominal 5.0V module (HC006A6A) to 4.90V % = 2
1690 Rtrim - down = - 73.1 k 2
Rtrim - down = 771.9k
To trim up the output of a nominal 3.3V module (HC010A0F) to 3.63V % = 10
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Data Sheet May 16, 2008
HC006/010 Series DC-DC Power Module: 18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
Thermal Considerations
The power modules operate in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation. Considerations include ambient temperature, airflow, module power dissipation, and the need for increased reliability. A reduction in the operating temperature of the module will result in an increase in reliability. The thermal data presented here is based on physical measurements taken in a wind tunnel. The thermal reference point, Tref used in the specifications is shown in Figure 18. For reliable operation this temperature should not exceed 110 oC Figure 19. Suggested Configuration for EN55022 Class B. For further information on designing for EMC compliance, please refer to the FLTR100V10 data sheet (FDS01-043EPS).
Layout Considerations
Q203
Tref Airflow Figure 18. Tref Temperature Measurement Location.
The HC power module series are low profile in order to be used in fine pitch system card architectures. As such, component clearance between the bottom of the power module and the mounting board is limited. Avoid placing copper areas on the outer layer directly underneath the power module. Also avoid placing via interconnects underneath the power module. For additional layout guide-lines, refer to FLTR100V10 data sheet.
Please refer to the Application Note "Thermal Characterization Process For Open-Frame BoardMounted Power Modules" for a detailed discussion of thermal aspects including maximum device temperatures.
Heat Transfer via Convection
Increased airflow over the module enhances the heat transfer via convection. Derating figures showing the maximum output current that can be delivered by each module versus local ambient temperature (TA) for natural convection and up to 3m/s (600 ft./min) are shown in the respective Characteristics Curves section.
EMC Considerations
The figure 19 shows a suggested configuration to meet the conducted emission limits of EN55022 Class B.
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Data Sheet May 16, 2008
HC006/010 Series DC-DC Power Module: 18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
Mechanical Outline for Surface-Mount Module
Dimensions are in millimeters and (inches). Tolerances: x.x mm 0.5 mm (x.xx in. 0.02 in.) [Unless otherwise indicated] x.xx mm 0.25 mm (x.xxx in 0.010 in.)
47.2 (1.86)
Top View
29.5 (1.16)
18
17
11
1
2
9
0.06 x 0.06 chamffer
Side View
2.5 (0.10) min stand-off height
8.50 (0.335) MAX
0.5 (.020) max compliance
Bottom View
1.7 (0.07)
3.6 (0.14) TRIM
VO+ VO-
Pin
1 2 9 11 17 18
Function
Vo(+) Vo(-) Trim On/Off Vin(-) Vin(+)
5.00 (0.197) 26.16 (1.030)
VI+ VI-
On/Off
35.00 (1.375) 40.00 (1.575)
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Data Sheet May 16, 2008
HC006/010 Series DC-DC Power Module: 18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
Mechanical Outline for Through Hole Module
Dimensions are in millimeters and [inches]. Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated) x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Top View
Side View
* Optional pin lengths shown in Table 2 Device Options
Bottom View
Pin
1 2 9 11 17 18
Function
Vo(+) Vo(-) Trim On/Off Vin(-) Vin(+)
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Data Sheet May 16, 2008
HC006/010 Series DC-DC Power Module: 18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
Recommended Pad Layout for Surface Mount and Through Hole Module
Dimensions are in millimeters and [inches]. Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated) x.xx mm 0.25 mm [x.xxx in 0.010 in.]
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Data Sheet May 16, 2008
HC006/010 Series DC-DC Power Module: 18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
Packaging Details
The surface mount versions of the HW005 family are also available in tape & reel (suffix -SR) as an option. Detailed of tape dimensions are shown below. Modules are shipped in quantities of 115 per reel. Tape Dimensions Dimensions are in millimeters and (inches).
PICK POINT
4.00 (0.157)
40.00 (1.575)
9.02 (0.355)
34.20 (1.346)
FEED DIRECTION
72.00 (2.834) 68.40 (2.692)
66.50 (2.692)
TOP COVER TAPE
EMBOSSED CARRIER
NOTE: CONFORMS TO EAI-481 REV. A STANDARD
Reel Dimensions Outside diameter: Inside diameter: Tape Width:
330.2 mm (13.00") 177.8 mm (7.00") 72.00 mm (2.834")
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Data Sheet May 16, 2008
HC006/010 Series DC-DC Power Module: 18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
Through-Hole Lead-Free Soldering Information
The RoHS-compliant through-hole products use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant components. They are designed to be processed through single or dual wave soldering machines. The pins have an RoHS-compliant finish that is compatible with both Pb and Pb-free wave soldering processes. A maximum preheat rate of 3C/s is suggested. The wave preheat process should be such that the temperature of the power module board is kept below 210C. For Pb solder, the recommended pot temperature is 260C, while the Pb-free solder pot is 270C max. Not all RoHS-compliant through-hole products can be processed with paste-through-hole Pb or Pb-free reflow process. If additional information is needed, please consult with your Lineage Power representative for more details.
Figure 21. Surface Mount Packaging Tray Tray Specification
Material Max temperature Max surface resistivity Colour Capacity Min order quantity trays) Antistatic coated PVC 65oC 10 /sq Clear 15 power modules 45 pcs (1box of 3 full
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Surface Mount Information
Packaging Details
The surface mount versions of the HC family (suffix - S) are supplied as standard in the plastic tray shown in Figure 21. The tray has external dimensions of 136mm (W) x 322.6mm (L) x 18.4mm (H) or 5.35in (W) x 12.7in (L) x 0.72in (H).
Each tray contains a total of 15 power modules. The trays are self-stacking and each shipping box will contain 3 full trays plus one empty hold down tray giving a total number of 45 power modules.
Pick and Place
The HC-S series of DC-to-DC power converters use an open-frame construction and are designed for surface mount assembly within a fully automated manufacturing process. The HC-S series modules are fitted with a Kapton label designed to provide a large flat surface for pick and placing. The label is located covering the Centre of Gravity of the power module. The label meets all the requirements for surface-mount processing, as well as meeting UL safety agency standards. The label will withstand reflow temperatures up to 300C. The label also carries product information such as product code, date and location of manufacture.
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Data Sheet May 16, 2008
HC006/010 Series DC-DC Power Module: 18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
Surface Mount Information (continued)
damage to the modules, and can adversely affect long-term reliability. The surface mountable modules in the HC family use our newest SMT technology called "Column Pin" (CP) connectors. Fig 23 shows the new CP connector before and after reflow soldering onto the end-board assembly.
HC Board
X
14mm (0.57in)
Insulator
21mm (0.84in)
Solder Ball End assembly PCB
Note: All dimensions in mm. Figure 22. Pick and Place Location. Z Plane Height The `Z' plane height of the pick and place location is 7.50mm nominal with an RSS tolerance of +/-0.25 mm.
Figure 23. Column Pin Connector Before and After Reflow Soldering. The CP is constructed from a solid copper pin with an integral solder ball attached, which is composed of tin/lead (Sn/Pb) solder. The CP connector design is able to compensate for large amounts of co-planarity and still ensure a reliable SMT solder joint. Typically, the eutectic solder melts at 183oC, wets the land, and subsequently wicks the device connection. Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. There are several types of SMT reflow technologies currently used in the industry. These surface mount power modules can be reliably soldered using natural forced convection, IR (radiant infrared), or a combination of convection/IR. For reliable soldering the solder reflow profile should be established by accurately measuring the modules CP connector temperatures.
300
Nozzle Recommendations
The module weight has been kept to a minimum by using open frame construction. Even so, they have a relatively large mass when compared with conventional SMT components. Variables such as nozzle size, tip style, vacuum pressure and placement speed should be considered to optimize this process. The minimum recommended nozzle diameter for reliable operation is 6mm. The maximum nozzle outer diameter, which will safely fit within the allowable component spacing, is 9 mm. Oblong or oval nozzles up to 11 x 9 mm may also be used within the space available. For further information please contact your local Lineage Power Technical Sales Representative.
P eak Temp 235oC
250
REFLOW TEMP (C)
Reflow Soldering Information
The HC family of power modules is available for either Through-Hole (TH) or Surface Mount (SMT) soldering. These power modules are large mass, low thermal resistance devices and typically heat up slower than other SMT components. It is recommended that the customer review data sheets in order to customize the solder reflow profile for each application board assembly. The following instructions must be observed when SMT soldering these units. Failure to observe these instructions may result in the failure of or cause
200
Heat zo ne max 4oCs -1
Co o ling zo ne 1 oCs -1 -4
150
100
So ak zo ne 30-240s P reheat zo ne max 4oCs -1
Tlim above 205oC
50
0
REFLOW TIME (S)
Figure 24. Recommended Reflow Profile
LINEAGE POWER
17
Data Sheet May 16, 2008
HC006/010 Series DC-DC Power Module: 18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
stored at the following conditions: < 40 C, < 90% relative humidity.
Surface Mount Information (continued)
240 235
MSL Rating
The HW/HC series SMT modules have a MSL rating of 1.
MAX TEMP SOLDER (C)
230 225 220 215 210 205 200 0 10 20 30 40 50 60
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning and drying procedures, refer to Lineage Power Board Mounted Power Modules: Soldering and Cleaning Application Note (AP01-056EPS).
300
Per J-STD-020 Rev. C
TIME LIMIT (S)
Figure 25. Time Limit Curve Above 205oC Reflow .
Lead Free Soldering
The SMT modules of the HW/HC series are lead-free (Pb-free) and RoHS compliant and are both forward and backward compatible in a Pb-free and a SnPb soldering process. Failure to observe the instructions below may result in the failure of or cause damage to the modules and can adversely affect long-term reliability.
Reflow Temp ( C)
250
Peak Temp 245 C
Cooling Zone 4 C / second * Min. Time Above 235 C 15 seconds
200
150
Heating Zone 1 C / second
* Time Above 217 C 60 seconds
100
50
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. This standard provides a recommended forced-air-convection reflow profile based on the volume and thickness of the package (table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The recommended linear reflow profile using Sn/Ag/Cu solder is shown in Figure. 26.
0 Reflow Time (in seconds)
Figure 26. Recommended linear reflow profile using Sn/Ag/Cu solder.
Solder Ball and Cleanliness Requirements
The open frame (no case or potting) power module will meet the solder ball requirements per J-STD-001B. These requirements state that solder balls must neither be loose nor violate the power module minimum electrical spacing. The cleanliness designator of the open frame power module is C00 (per J specification).
Storage and Handling
The recommended storage environment and handling procedures for moisture-sensitive surface mount packages is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). Moisture barrier bags (MBB) with desiccant are required for MSL ratings of 2 or greater. These sealed packages should not be broken until time of use. Once the original package is broken, the floor life of the product at conditions of 30C and 60% relative humidity varies according to the MSL rating (see J-STD-033A). The shelf life for dry packed SMT packages will be a minimum of 12 months from the bag seal date, when
LINEAGE POWER
18
Data Sheet May 16, 2008
HC006/010 Series DC-DC Power Module: 18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
Ordering Information
Please contact your Lineage Power Sales Representative for pricing, availability and optional features. Table 1. Device Codes Input Voltage 24 (18 - 36) Vdc 24 (18 - 36) Vdc 24 (18 - 36) Vdc 24 (18 - 36) Vdc 24 (18 - 36) Vdc 24 (18 - 36) Vdc 24 (18 - 36) Vdc Output Voltage 3.3 V 3.3 V 5.0V 5.0V 5.0V 5.0V 5.0V Output Current 10A 10A 6.6A 6.6A 6.6A 6.6A 6.6A Remote On/Off Logic Negative Negative Negative Negative Negative Negative Negative Connector Type SMT SMT SMT SMT TH TH TH Product codes HC010A0F1-S HC010A0F1-SZ HC006A6A1-S HC006A6A1-SZ HC006A6A1 HC006A6A1Z HC006A6A61Z Comcodes 108975442 109100220 108975459 109100212 108994281 CC109107100 CC109140266
Table 2. Device Options Option Negative remote on/off logic Short Pins: 3.68 mm 0.25 mm (0.145 in 0.010 in) Short Pins: 2.79 mm 0.25 mm (0.110 in 0.010 in) Tape & Reel Surface mount connections RoHS Compliant Suffix 1 6 8 -R -S -Z
Asia-Pacific Headquarters Tel: +65 6416 4283 Europe, Middle-East and Africa Headquarters Tel: +49 89 6089 286 India Headquarters Tel: +91 80 28411633
World Wide Headquarters Lineage Power Corporation 3000 Skyline Drive, Mesquite, TX 75149, USA +1-800-526-7819 (Outside U.S.A.: +1-972-284-2626) www.lineagepower.com e-mail: techsupport1@lineagepower.com
Lineage Power reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. (c) 2008 Lineage Power Corporation, (Mesquite, Texas) All International Rights Reserved.
Document No: DS03-122 ver. 1.44 PDF name: hc006-010_series_ds.pdf

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